Heidelberg Instruments DWL 200 , Laser, Gencobot 7/2L

Heidelberg Instruments DWL 200 , Laser direct exposure unit

automatic loading with Genmark robots,

Wafer pre-aligner for wafers with a diameter of 100 - 200 mm,

Additional equipment: iWave laser from Toptica 404 nm, max. 50 mW;

Writing heads with 4, 6 and 10 mm focal length;

Conversion computer with 2018 upgrade to online conversion.

USED, IN GOOD VISUAL CONDITION, NOT TESTED.

Not tested. sold AS IS ;

Packing and preparation for shipment available upon request.